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首页> 外文期刊>The International Journal of Advanced Manufacturing Technology >A wrapper approach-based key temperature point selection and thermal error modeling method
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A wrapper approach-based key temperature point selection and thermal error modeling method

机译:基于包装方法的关键温度点选择和热误差建模方法

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摘要

A wrapper approach-based key temperature point selection and thermal error modeling method is proposed to concurrently screen the optimal key temperature points and construct the thermal error model. This wrapper approach can strengthen the intrinsic relation between the key temperature points and the thermal error model to ensure the strong prediction performance. On the whole, the least squares support vector machine (SVM) is used as the basic thermal error modeling method and the binary bat algorithm (BBA) is used as the optimization algorithm. The selection status of temperature points and the values of hyperparameters gamma and sigma(2) of SVM are coded in separate binary parts of the artificial bat's position vector of BBA. The cost function is designed by balancing the prediction error and the number of key temperature points. For verification, the thermal error experiment was conducted on a horizontal machining center. Feeding the collected experimental temperature data and thermal error data to the proposed method, three optimal key temperature points were screened out and the corresponding optimal hyperparameters were simultaneously searched. To verify the superiority of the proposed method, the prediction performance comparison analysis was conducted with the conventional filter-based method. Specifically, in the conventional method, the key temperature points were screened by combining fuzzy c means (FCM) clustering and correlation analysis, and the multiple linear regression (MLR), the backpropagation neural network (BPNN), and the SVM were used to build the thermal error model, respectively. Comparison results showed that the prediction accuracy of the proposed method increased by up to 44.0% compared to the conventional method, which suggests the superior prediction performance of the proposed method.
机译:提出了一种包装接近的关键点选择和热误差建模方法,以同时筛选最佳键温度点并构建热误差模型。这种包装方法可以加强关键温度点与热误差模型之间的内在关系,以确保强烈的预测性能。总的来说,最小二乘支持向量机(SVM)用作基本的热误差建模方法,并且二进制BAT算法(BBA)用作优化算法。 SVM的温度点的选择状态和SVM的封闭伽马和Sigma(2)的值被编码在BBA的人工蝙蝠位置矢量的单独二进制部分中。成本函数是通过平衡预测误差和关键温度点的数量来设计的。为了验证,在水平加工中心进行热误差实验。将收集的实验温度数据和热误差数据馈送到所提出的方法,筛选出三个最佳的键温度点,并同时搜索相应的最佳超参数。为了验证所提出的方法的优越性,通过传统的基于滤光片的方法进行预测性能比较分析。具体地,在传统方法中,通过组合模糊C装置(FCM)聚类和相关性分析,以及多元线性回归(MLR),反向化神经网络(BPNN)以及SVM来筛选密钥温度点,并使用SVM来构建热误差模型分别。比较结果表明,与传统方法相比,所提出的方法的预测精度增加到44.0%,这表明了所提出的方法的卓越预测性能。

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