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首页> 外文期刊>The International Journal of Advanced Manufacturing Technology >Preventing delayed cracks in SUS304 deep drawn cups using extreme blank holding forces aided by nanolubrication
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Preventing delayed cracks in SUS304 deep drawn cups using extreme blank holding forces aided by nanolubrication

机译:防止SUS304深拉杯中的延迟裂缝使用纳米鲁布辅助极端坯料保持力

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Disappearance and reappearance of delayed cracks were observed in deep drawing process of SUS304 cylindrical cups under elevated blank holding forces (BHF) of 8 similar to 32kN with nanolubricants containing 1 similar to 3wt% SiO2 concentrations at limiting draw ratio. The widest crack-free BHF range determined experimentally, i.e., 29 similar to 31kN was for 2wt% SiO2. Delayed cracks were observed below and beyond this BHF range. The frictional force at the flange surfaces slightly increased when entering the crack-free BHF range, as evidenced by the rebound in sidewall thickness, relative intensity of -martensite, elongated height, and drawing force beyond 28kN. The coefficients of friction for each BHF were obtained with finite element simulations. Since residual stresses developed along the outer surface of the cup due to the unbending of the material when the material left the draw die profile, the slight increase in frictional force in the radial direction along the flange surfaces reduced the circumferential tensile residual stress of the cup, particularly at 80% cup height. The elimination of delayed cracks was attributed to the lower tensile residual stress gradient, i.e., lower and higher tensile residual stresses at 80% and 100% cup heights, respectively. However, the excessive increase at 100% cup height was a result of the increase in longitudinal compressive stress at BHF beyond 31kN due to the stress equilibrium, leading to the reappearance of cracks. The minimum BHF required to eliminate cracks changed minimally with increasing SiO2 concentration.
机译:在80k的升高的坯料保持力(BHF)下的SUS304圆柱形杯的深度拉伸过程中观察到延迟裂缝的消失和重新突出,其与含有类似于3wt%SiO 2浓度的纳米脂质剂以限制拉伸比例。实验确定的最宽的无裂缝的BHF范围,即类似于31kN的29,对于2wt%SiO 2。下面观察到延迟裂缝,超出该BHF范围。当进入无裂缝的BHF范围时,凸缘表面处的摩擦力略微增加,如侧壁厚度,相对强度,伸长高度和超出28kn的拉伸力的反弹所证明。通过有限元模拟获得每个BHF的摩擦系数。由于当材料留下凹凸型材时,由于材料的外表面沿着杯子的外表面产生的残余应力,因此沿着凸缘表面的径向沿径向摩擦力的略微增加降低了杯子的周向拉伸残余应力,特别是在80%的杯子高度。消除延迟裂缝的消除归因于较低的拉伸残余应力梯度,即分别在80%和100%杯高度下降低和更高的拉伸残余应力。然而,100%杯高度的过度增加是由于应力平衡引起的BHF超过31kN的纵向压缩应力的增加,导致裂缝重新出现。消除裂缝所需的最小BHF随着SiO 2浓度的增加而变化。

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