首页> 外文期刊>The International Journal of Advanced Manufacturing Technology >An investigation in the ultra-precision fly cutting of freeform surfaces on brittle materials with high machining efficiency and low tool wear
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An investigation in the ultra-precision fly cutting of freeform surfaces on brittle materials with high machining efficiency and low tool wear

机译:高加工效率和低工具磨损脆性脆性材料超精密飞行

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摘要

In diamond machining of freeform surface on brittle materials, very small machining parameters are necessarily adopted to suppress the brittle fractures, which inevitably leads to low processing efficiency as well as fast tool wear. In the present study, ultra-precision fly cutting is first adopted in processing brittle materials for freeform surfaces to improve machining efficiency and reduce tool wear. In fly cutting, a large swing radius (over 40mm) is configured between the diamond tool tip and the rotation axis of the spindle, so the workpiece material is intermittently removed by the periodical cut-in and cut-out movement of the diamond tool. The theoretical results show that this unique process generates a very small chip thickness (80nm) even under large feed rates (9m/r) and cutting depths (70m), which accordingly improves the machining efficiency without generating brittle fractures. The experimental results show that only 200min is needed in fly cutting of an F-theta lens with height variation over 50m on single-crystal silicon, while over doubled time is needed for conventional slow tool servo. The generated surface is very smooth and uniform with a roughness of only 6nm Sa. Besides, only micro-ruggedness of diamond tool is formed in fly cutting without the premature appearance of the micro-chips, which enhances tool life and reduces the re-sharpening cost of diamond tools in processing brittle materials.
机译:在脆性材料的自由曲面的金刚石加工,非常小的加工参数必然采用抑制脆性断裂,这不可避免地导致低的加工效率,以及快速刀具磨损。在本研究中,超精密快速切削加工脆性材料为自由形式首先通过表面来提高加工效率,降低刀具的磨损。在快速切削,大的回转半径(在40mm以上)被配置金刚石刀具尖端与主轴的旋转轴线之间,所以工件材料是由周期性切入和切出的移动金刚石刀具的间歇除去。理论结果表明,这种独特的方法产生一个非常小的芯片的厚度(80纳米),即使在大的进料速率(9米/ r)和切削深度(70米),其相应地提高,而不会产生脆性断裂加工效率。实验结果表明,只有200min需要在F-θ超过上单晶硅50米高度变化透镜的快速切削,而需要用于常规缓慢工具伺服超过一倍的时间。所生成的表面非常光滑且均匀的,只有6nm的Sa的粗糙度此外,在形成金刚石工具的仅微耐用性在快速切削而不微芯片的外观过早,这增强了刀具的寿命并减少了在加工脆性材料的金刚石工具的再锐化成本。

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