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Correlation between the resistivity and the atomic clusters in liquid Cu-Sn alloys

机译:液体Cu-Sn合金电阻率与原子簇之间的相关性

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摘要

The liquid structure of CuxSn100-x (x = 0, 10, 20, 33, 40, 50, 60, 75, 80 and 100) alloys with atom percentage were investigated with resistivity and viscosity methods. It can be found from the resistivity data that the liquid Cu75Sn25 and Cu80Sn20 alloys had a negative temperature coefficient of resistivity (TCR), and liquid Cu75Sn25 alloy had a minimum value of -9.24 mu Omega cm K-1. While the rest of liquid Cu-Sn alloys had a positive TCR. The results indicated that the Cu75Sn25 atomic clusters existed in Cu-Sn alloys. In addition, the method of calculating the percentage of Cu75Sn25 atomic clusters was established on the basis of resistivity theory and the law of conservation of mass. The Cu75Sn25 alloy had a maximum volume of the atomic clusters and a highest activation energy. The results further proved the existence of Cu75Sn25 atomic clusters. Furthermore, the correlation between the liquid structure and the resistivity was established. These results provide a useful reference for the investigation of liquid structure via the sensitive physical properties to the liquid structure.
机译:用电阻率和粘度方法研究具有原子百分比的CuxSN100-X(x = 0,10,20,33,40,50,60,75,80和100)合金的液体结构。从液体Cu75SN25和Cu80SN20合金具有负温度的电阻率(TCR)的电阻率数据中,液体Cu75Sn25合金的电阻率数据可以存在于-9.24μmωcmk-1的最小值。虽然其余的液体Cu-Sn合金具有阳性TCR。结果表明Cu75Sn25原子簇存在于Cu-Sn合金中。此外,基于电阻率理论和质量守恒定律,建立计算Cu75Sn25原子簇百分比的方法。 Cu75Sn25合金具有最大体积的原子簇和最高的活化能量。结果进一步证明了Cu75Sn25原子簇的存在。此外,建立了液体结构与电阻率之间的相关性。这些结果提供了通过对液体结构的敏感物理性质来研究液体结构的有用参考。

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