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High acceleration and angular velocity micro vibrating platform with Chock for IMU integration

机译:高速加速度和角速度微振动平台,用于IMU集成

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摘要

Integrated multiple degree of freedom (DOF) micro vibrating platform is an emerging approach for self calibration of long-term drifts in scale factor and offset of multi-axis MEMS-based inertial measurement units (IMU). A 3-DOF piezoelectric micro vibrating platform based on PZT-SOI with high acceleration and angular velocity by wafer-level fabrication is presented. To achieve the motion of out-of-plane movement and X/Y plane tilt, the structural optimization of the supporting folded beams has been investigated and analyzed, aiming to keep the optimal balance between stiffness, elastic coefficient and system damping ratio for the vibrating platform. The IMU is integrated on the vibrating platform with electrical connection by a two-layer routing scheme by silicon dioxide isolation. The out-of-plane acceleration and X/Y tilting angular velocity of the integrated system reach up to 34.8 g and 2500 degrees/s. respectively. The micro vibrating platform with high dynamic performances plays an important role in the applications for MEMS inertial sensors with high measurement ranges. (C) 2019 Elsevier B.V. All rights reserved.
机译:集成多程度的自由度(DOF)微振动平台是一种新兴方法,用于在规模因子中的长期漂移和基于多轴MEMS的惯性测量单元(IMU)的偏移量的长期漂移的新兴方法。提出了一种基于PZT-SOI的3-DOF压电微振动平台,通过晶片级制造具有高加速度和角速度。为了实现平面外运动和X / Y平面倾斜的运动,已经研究并分析了支撑折射梁的结构优化,旨在保持振动的刚度,弹性系数和系统阻尼比之间的最佳平衡平台。 IMU集成在振动平台上,通过二氧化硅隔离通过双层路由方案电气连接。平面外加速度和X / Y倾斜集成系统的角速度达到高达34.8g和2500度/ s。分别。具有高动态性能的微振动平台在MEMS惯性传感器具有高测量范围的应用中起重要作用。 (c)2019 Elsevier B.v.保留所有权利。

著录项

  • 来源
    《Sensors and Actuators, A. Physical》 |2019年第2019期|共10页
  • 作者单位

    Univ Elect Sci &

    Technol China Sch Elect Sci &

    Engn Chengdu Sichuan Peoples R China;

    China Acad Engn Phys Microsyst &

    Terahertz Res Ctr Chengdu Sichuan Peoples R China;

    China Acad Engn Phys Microsyst &

    Terahertz Res Ctr Chengdu Sichuan Peoples R China;

    China Acad Engn Phys Microsyst &

    Terahertz Res Ctr Chengdu Sichuan Peoples R China;

    China Acad Engn Phys Microsyst &

    Terahertz Res Ctr Chengdu Sichuan Peoples R China;

    China Acad Engn Phys Microsyst &

    Terahertz Res Ctr Chengdu Sichuan Peoples R China;

    China Acad Engn Phys Microsyst &

    Terahertz Res Ctr Chengdu Sichuan Peoples R China;

    China Acad Engn Phys Microsyst &

    Terahertz Res Ctr Microsyst Technol Lab Chengdu Sichuan Peoples R China;

    Univ Elect Sci &

    Technol China Sch Elect Sci &

    Engn Chengdu Sichuan Peoples R China;

    China Acad Engn Phys Microsyst &

    Terahertz Res Ctr Chengdu Sichuan Peoples R China;

  • 收录信息
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 TP212.1;
  • 关键词

    Micro vibrating platform; High acceleration; Wafer-level fabrication; IMU integration;

    机译:微振动平台;高加速度;晶圆级制造;IMU集成;

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