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3D printing of milk-based product

机译:3D印刷牛奶基产品

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摘要

We developed a method to perform direct ink writing (DIW) three-dimensional (3D) printing of milk products at room temperature by changing the rheological properties of the printing ink. 3D printing of food products has been demonstrated by different methods such as selective laser sintering (SLS) and hot-melt extrusion. Methods requiring high temperatures are, however, not suitable to creating 3D models consisting of temperature-sensitive nutrients. Milk is an example of such foods rich in nutrients such as calcium and protein that would be temperature sensitive. Cold-extrusion is an alternative method of 3D printing, but it requires the addition of rheology modifiers and the optimization of the multiple components. To address this limitation, we demonstrated DIW 3D printing of milk by cold-extrusion with a simple formulation of the milk ink. Our method relies on only one milk product (powdered milk). We formulated 70 w/w% milk ink and successfully fabricated complex 3D structures. Extending our method, we demonstrated multi-material printing and created food with various edible materials. Given the versatility of the demonstrated method, we envision that cold extrusion of food inks will be applied in creating nutritious and visually appealing food, with potential applications in formulating foods with various needs for nutrition and materials properties, where food inks could be extruded at room temperature without compromising the nutrients that would be degraded at elevated temperatures.
机译:我们开发了一种通过改变印刷油墨的流变性能在室温下执行直接墨水写入(DIW)三维(3D)印刷的方法。通过不同的方法证明了食品的3D印刷,例如选择性激光烧结(SLS)和热熔挤出。然而,需要高温的方法是不适合创建由温度敏感营养素组成的3D模型。牛奶是富含营养素的食物的一个例子,如将温度敏感的钙和蛋白质。冷挤出是一种替代方法的3D打印方法,但它需要添加流变改性剂和多个组分的优化。为了解决这一限制,我们通过冷挤出来证明DIW 3D印刷牛奶的简单配方。我们的方法只依赖于一种乳产品(粉末牛奶)。我们制定了70%w / w%牛奶油墨,并成功地制造了复杂的3D结构。延长我们的方法,我们展示了多材料印刷和用各种可食用材料创造食物。鉴于证明方法的多功能性,我们设想食物油墨的冷挤压将应用于创造营养和视觉上吸引人的食物,其中潜在的应用在配制营养和材料性质的各种需求中,可以在室内挤出食品油墨温度不影响将在升高的温度下降解的营养物质。

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  • 来源
    《RSC Advances 》 |2020年第50期| 共8页
  • 作者单位

    Singapore Univ Technol &

    Design Pillar Engn Prod Dev 8 Somapah Rd Singapore 487372 Singapore;

    Singapore Univ Technol &

    Design SUTD MIT Int Design Ctr IDC 8 Somapah Rd Singapore 487372 Singapore;

    Singapore Univ Technol &

    Design Pillar Engn Prod Dev 8 Somapah Rd Singapore 487372 Singapore;

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  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 化学 ;
  • 关键词

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