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Microfluidic Encapsulation of Phase-Change Materials for High Thermal Performance

机译:用于高热性能的相变材料的微流体封装

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Microencapsulation of phase-change materials (PCMs) can prevent leakage of PCMs and enhance heat transfer with an increased surface area to volume ratio and thus benefit their pragmatic applications. However, the available methods have difficulties in microencapsulating PCMs with a tunable size, structure, and composition at will, thereby failing to accurately and flexibly tailor the thermal properties of microencapsulated PCMs (MEPCMs). Here, the microfluidic encapsulation of PCMs was presented for precisely fabricating MEPCMs with tunable thermal properties. The versatile fabrication of both organic and inorganic MEPCMs was demonstrated with high monodispersity, energy storage capacity, encapsulation efficiency, thermal stability, reliability, and heat charging and discharging rates. Notably, the inorganic MEPCMs exhibit an energy storage capacity of 269.3 J/g and a charging rate of 294.7 J/(g min), surpassing previously reported values. Owing to their high thermal performance, MEPCMs have been used for anticounterfeit applications. Droplet-based microfluidic fabrication opens up a new avenue for versatile fabrication of MEPCMs with well-tailored thermal properties, thus benefitting their applications.
机译:相变材料(PCM)的微胶囊可以防止PCM的泄漏并增强具有增加的表面积与体积比的热传递,从而有利于其务实的应用。然而,可用方法在微胶囊悬浮的PCM具有可调谐尺寸,结构和组合物中的困难,从而不能准确和灵活地定制微胶囊化PCM(Mepcms)的热性质。这里,提出了PCM的微流体包封,用于精确地制造具有可调谐热性质的Mepcm。有机和无机Mepcms的多功能制造以高单体,能量存储容量,封装效率,热稳定性,可靠性和热充电和放电速率证明了有机和无机Mepcms。值得注意的是,无机Mepcms表现出269.3J / g的能量存储容量,充电率为294.7 j /(g min),超过先前报告的值。由于其高热性能,Mepcms已被用于抗预订应用。基于液滴的微流体制造开辟了一种新的途径,用于具有良好定制的热性能的Mepcms的多功能制造,从而使其应用。

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