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On the mechanism ruling the morphology of silicon nanowires obtained by one-pot metal-assisted chemical etching

机译:鉴定一锅金属辅助化学蚀刻获得的硅纳米线形态的机制

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摘要

One-pot Ag-assisted chemical etching (SACE) of silicon provides an effective, simple way to obtain Si nanowires (NWs) of potential interest for technological applications ranging from photovoltaics to thermoelectricity. The detailed mechanism ruling the process has not been yet fully elucidated, however. In this paper we report the results of an extended analysis of the interplay among doping level and type of silicon, nanowire nanomorphology and the parameters controlling the chemistry of the etching process. We provide evidence that the SACE mechanism entirely occurs at the interface between the etching solution and the Si substrate as a result of Si extrusion by sinking self-propelled Ag particles. Also, a rationale is advanced to explain the reported formation of (partially) porous NWs at high doping levels in both p- and n-type Si. A model not relying on the asserted formation of potential barriers enables to recover full consistency between SACE electrochemistry and the mechanism of formation of porous silicon in electrochemical cells.
机译:硅的一锅Ag Ag辅助化学蚀刻(SACE)提供了一种有效的简单方法,以获得从光伏从光伏到热电的技术应用的潜在兴趣的Si纳米线(NWS)。然而,详细的机制统治该过程尚未完全阐明。在本文中,我们报告了掺杂水平和硅,纳米线纳米形态的相互作用的扩展分析结果,以及控制蚀刻工艺化学的参数。我们提供了证据表明,由于Si挤出通过沉入自推进的Ag颗粒,因此SACE机制完全发生在蚀刻溶液和Si衬底之间的界面处。此外,基本原理是在P-and N型Si中的高掺杂水平下报道的(部分)多孔NWS的报告的形成。不依赖于潜在屏障的断言形成的模型能够在电化学电池中恢复SACE电化学与多孔硅的形成机制。

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