Surface-mount bowtie antenna element for millimeter-wave applications

摘要

A surface-mount bowtie antenna element with a ball grid array (BGA) packaging is proposed. Compared to a two-dimensional end-fire antenna, the proposed surface-mount antenna element is a discrete three-dimensional structure for obtaining a broadside radiation pattern. The proposed antenna element is mounted on the motherboard and fed by the balun located at the bottom layer of the motherboard to obtain a wide impedance bandwidth. In addition, the proposed antenna with the BGA packaging provides a cost-effective solution for integration with surface-mount devices on the same system board. The performance of the antenna prototype was verified by measurements.