Stacked microstrip patch antenna design for ISM band applications with 3D-printing technology

摘要

With the advances in the 3Dprinting technology these technologies are being used in many fields for fast and low-cost prototyping procceses. One of the commonoly used applications is manufacturing of microwave circuits. Herein, design and realization of stacked microstrip patch array (SMPA) antenna for ISM band application with 3D-printing technology is presented. Firstly design of a SMPA antenna consist of a patch fed by a microstrip line and a staced patch array 2x2 rectangular patch is studied for ISM band applications. Next, the antenna is fabricated by using a 3D printer. From the experiment results it can be concluded that 3D-printed antenna has good performance, within the operation band with a good return loss performance of -10 dB and a moderate gain of 11 dBi. Thus, in this work an efficient prototyping method had been proposed for low-cost, high-accuracy, and fast prototyping of microwave antennas by using 3D-printer.