首页> 外文期刊>Journal of Physics. Condensed Matter >A high-resolution core-level photoemission study of the Au/4H-SiC(0001)-(root 3 x root 3) interface
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A high-resolution core-level photoemission study of the Au/4H-SiC(0001)-(root 3 x root 3) interface

机译:Au / 4H-SiC(0001)-(根3 x根3)界面的高分辨率核心级光发射研究

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摘要

We present a systematic study of different reconstructions obtained after deposition of Au on the (root 3 x root 3)- R30 degrees- 4H- SiC( 0001) surface. For 1-2 monolayers ( ML) Au and annealing temperature T-anneal similar to 675 degrees C, a 3 x 3 reconstruction was observed. For 4 ML Au and T-anneal similar to 650 degrees C, a ( 2 root 3 x 2 root 3)- R30 degrees. reconstruction appeared, while 5ML Au annealed at 700 degrees C reconstructed to give a ( 6 root 3 x 6 root 3)- R30 degrees. pattern. From the Si 2p and Au 4f core- level components, we propose interface models, depending on the amount of Au on the surface and the annealing temperature. For 1 - 4 ML Au annealed at 650 - 675 degrees C, gold diffuses under the topmost Si into the SiC and forms a silicide. An additional Si component in our Si 2p spectra is related to the interface between the silicide and SiC. For 5 ML Au annealed at 700 degrees C, silicide is also formed at the surface, covering unreacted Au on top of the SiC substrate. The interface Si component is also observed in the Si 2p spectra of this surface. The key role in Au/root 3- 4H- SiC( 0001) interface formation is played by diffusion and the silicon- richness of the surface.
机译:我们提出了在(根3 x根3)-R30度-4H-SiC(0001)表面上沉积金后获得的不同重建物的系统研究。对于1-2个单层(ML)的Au和类似于675摄氏度的退火温度T退火,观察到3 x 3的重建。对于类似于650摄氏度的4 ML Au和T退火,(2根3 x 2根3)-R30摄氏度。出现了重构,同时在700摄氏度下退火了5毫升金,重构得到(6根3 x 6根3)-R30度。模式。根据Si 2p和Au 4f核心级组件,我们提出了界面模型,具体取决于表面上的Au量和退火温度。对于在650-675摄氏度下退火的1-4毫升金,金会在最上面的Si下扩散到SiC中并形成硅化物。 Si 2p光谱中的其他Si成分与硅化物和SiC之间的界面有关。对于在700摄氏度下退火的5毫升金,硅化物也会在表面形成,覆盖SiC衬底顶部未反应的金。在该表面的Si 2p光谱中也观察到界面Si成分。金/根3-4H-SiC(0001)界面形成中的关键作用是表面的扩散和富硅性。

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