首页> 外文期刊>Journal of Physics, D. Applied Physics: A Europhysics Journal >Fabrication of a heterostructure device with Au/PPani-TiO_2/ITO configuration and study of device parameters including current conduction mechanism
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Fabrication of a heterostructure device with Au/PPani-TiO_2/ITO configuration and study of device parameters including current conduction mechanism

机译:具有Au / PPani-TiO_2 / ITO构型的异质结构器件的制备以及包括电流传导机理在内的器件参数的研究

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摘要

Polyaniline based composites incorporating titanium dioxide have been synthesized by an alternative pathway using reactive magnetron sputtering of titanium and plasma polymerization of aniline monomer. Structural, optical and morphological characterizations of plasma polymerized aniline (PPani) and titanium dioxide (TiO_2) composites (PPani-TiO_2) reveal the evidence for the incorporation of TiO_2 in the PPani matrix. A hybrid heterostructure device having PPani-TiO_2 composite with a top gold (Au) layer and bottom indium-tin oxide (ITO) layer is fabricated. The developed heterostructure device exhibits rectifying behaviour indicating the formation of a Schottky contact between Au and PPani-TiO_2. The detailed electrical measurement of the device is performed under different temperatures. The ideality factor (n) and barrier height (φ_B) of the heterojunction diode at room temperature (300 K) are found to be 1.28 and 0.43 eV, respectively. Possible conduction mechanisms are examined using various plotting and curve fitting methods for space charge limited conduction mechanism (SCLC), Schottky emission mechanism and Poole-Frenkel (PF) emission mechanism. The heterostructure device shows best fit of SCLC process as compared to the other mechanisms including Schottky emission and PF emission.
机译:已经通过使用钛的反应性磁控溅射和苯胺单体的等离子体聚合的替代途径合成了包含二氧化钛的基于聚苯胺的复合材料。等离子体聚合苯胺(PPani)和二氧化钛(TiO_2)复合材料(PPani-TiO_2)的结构,光学和形态学表征揭示了TiO_2掺入PPani基质的证据。制造了具有PPani-TiO_2复合材料的杂化异质结构器件,该复合材料具有顶部金(Au)层和底部铟锡氧化物(ITO)层。开发的异质结构器件表现出整流性能,表明在Au和PPani-TiO_2之间形成了肖特基接触。设备的详细电气测量在不同温度下进行。室温(300 K)下,异质结二极管的理想因子(n)和势垒高度(φ_B)分别为1.28和0.43 eV。对于空间电荷限制传导机制(SCLC),肖特基发射机制和Poole-Frenkel(PF)发射机制,使用各种绘图和曲线拟合方法检查了可能的传导机制。与其他机制(包括肖特基发射和PF发射)相比,异质结构器件显示出最适合SCLC工艺。

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