首页> 外文期刊>Journal of Non-Crystalline Solids: A Journal Devoted to Oxide, Halide, Chalcogenide and Metallic Glasses, Amorphous Semiconductors, Non-Crystalline Films, Glass-Ceramics and Glassy Composites >The influence of annealing temperature on the synthesis of silicon quantum dots embedded in hydrogenated amorphous Si-rich silicon carbide matrix
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The influence of annealing temperature on the synthesis of silicon quantum dots embedded in hydrogenated amorphous Si-rich silicon carbide matrix

机译:退火温度对氢化非晶富硅碳化硅基体中嵌入的硅量子点合成的影响

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Hydrogenated amorphous silicon carbide thin films (a-SiC:H) were prepared by plasma-enhanced chemical vapor deposition (PECVD) and thermal annealed at temperatures of 900, 1050, and 1200 degrees C, respectively. The influence of annealing temperature on the silicon quantum dot (QD) synthesis was investigated by Raman scattering spectroscopy, X-ray diffraction spectroscopy, and high-resolution transmission electron microscopy. The influence of annealing temperature on the chemical bonding configurations was revealed by Fourier transform infrared absorption microscopy. The element ratios of the as-deposited sample were deduced by X-ray photoelectron spectroscopy. Results reveal that the samples are in silicon-rich nature. Silicon in the as-deposited sample and the 900 degrees C annealed sample are amorphous. When the annealing temperature is increased to 1050 degrees C, crystal silicon QDs have come into being. The calculated number density is about 2.15 +/- 0.03 x 10(12) cm(-2) and more than 80 +/- 3% of the silicon QDs fall within a narrow size range of 2-3 nm. When the annealing temperature is increased to 1200 degrees C, the average size of crystal silicon QDs is tuned from 2.6 to 3.2 nm, while the crystallinity is enhanced from 56.7 +/- 2.5 to 67.1 +/- 1.5%. We attribute the influence of annealing temperature on the synthesis of silicon QDs to be dependent on the evolution of chemical bonding configurations and the agglomeration of silicon atoms from the host matrix. (C) 2016 Elsevier B.V. All rights reserved.
机译:通过等离子体增强化学气相沉积(PECVD)制备氢化非晶碳化硅薄膜(a-SiC:H),并分别在900、1050和1200摄氏度的温度下进行热退火。通过拉曼散射光谱,X射线衍射光谱和高分辨率透射电子显微镜研究了退火温度对硅量子点(QD)合成的影响。傅里叶变换红外吸收显微镜揭示了退火温度对化学键合构型的影响。通过X射线光电子能谱推算出所沉积的样品的元素比率。结果表明样品具有丰富的硅性质。沉积样品和900摄氏度退火样品中的硅是非晶态的。当退火温度升高到1050℃时,晶体硅QD已经形成。计算出的数密度约为2.15 +/- 0.03 x 10(12)cm(-2),超过80 +/- 3%的硅QD落在2-3 nm的狭窄尺寸范围内。当退火温度增加到1200摄氏度时,晶体硅QD的平均尺寸从2.6调整到3.2 nm,而结晶度从56.7 +/- 2.5增强到67.1 +/- 1.5%。我们将退火温度对硅量子点合成的影响归因于化学键合构型的演化以及基质基质中硅原子的团聚。 (C)2016 Elsevier B.V.保留所有权利。

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