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Thermoelectric properties of chromium disilicide prepared by mechanical alloying

机译:机械合金化法制备二硅化铬的热电性能

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CrSi and Cr_(1-x) Fe_x Si particles embedded in a CrSi_2 matrix have been prepared by hot pressing from CrSi_(1.9), CrSi_2, and CrSi_(2.1) powders produced by ball milling using either WC or stainless steel milling media. The samples were characterized by powder X-ray diffraction, scanning, and transmission electron microscopy and electron microprobe analysis. The final crystallite size of CrSi_2 obtained from the XRD patterns is about 40 and 80 nm for SS- and WC-milled powders, respectively, whereas the size of the second phase inclusions in the hot pressed samples is about 1-5 μm. The temperature dependence of the electrical resistivity, Seebeck coefficient, thermal conductivity, and figure of merit (ZT) were analyzed in the temperature range from 300 to 800 K. While the ball-milling process results in a lower electrical resistivity and thermal conductivity due to the presence of the inclusions and the refinement of the matrix microstructure, respectively, the Seebeck coefficient is negatively affected by the formation of the inclusions which leads to a modest improvement of ZT.
机译:嵌入在CrSi_2基体中的CrSi和Cr_(1-x)Fe_x Si颗粒是通过使用WC或不锈钢研磨介质通过球磨生产的CrSi_(1.9),CrSi_2和CrSi_(2.1)粉末热压制备的。通过粉末X射线衍射,扫描,透射电子显微镜和电子显微探针分析对样品进行表征。从XRD图案获得的CrSi_2的最终微晶尺寸,对于SS和WC研磨的粉末分别约为40和80 nm,而热压样品中第二相夹杂物的尺寸约为1-5μm。在300至800 K的温度范围内,分析了电阻率,塞贝克系数,热导率和品质因数(ZT)的温度依赖性。而球磨工艺会由于以下原因而导致较低的电阻率和热导率由于夹杂物的存在和基体组织的细化,塞贝克系数受到夹杂物形成的负面影响,从而导致ZT的适度提高。

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