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首页> 外文期刊>Journal of Materials Science >Microstructural, electrical, and mechanical characterization of Bi_ 2Cu_(0.1)V_(0.9)O_(5.35) (BICUVOX) ceramics fabricated from co-precipitated precursor powders
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Microstructural, electrical, and mechanical characterization of Bi_ 2Cu_(0.1)V_(0.9)O_(5.35) (BICUVOX) ceramics fabricated from co-precipitated precursor powders

机译:由共沉淀的前驱体粉末制成的Bi_2Cu_(0.1)V_(0.9)O_(5.35)(BICUVOX)陶瓷的微观结构,电学和机械特性

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摘要

Copper-doped bismuth vanadate (Bi_2Cu_(0.1)V_ (0.9)O_(5.35), BICUVOX) was synthesized by a co-precipitation process which resulted in a homogenous, fine-grained powder with an average particle size of ~0.45 μm. The consolidated BICUVOX powder was sintered at temperatures between 625 and 800 C for 0-8 h in air. The correlation between the thermal processing schedule and the final microstructure were completed for all conditions through stereological analysis of the resultant cross-sectional scanning electron microscope images. From this work, the sintering schedule of 675 C for 1 h resulted in acquiring a BICUVOX ceramic microstructure that displayed ~97 % relative density with an average grain size of ~1.29 μm. This processing condition was ~75-125 C lower than typical sintering temperatures for the same density, and resulted in a final grain size that is ~5-10 μm smaller in size. The four-point conductivity testing of the BICUVOX ceramics in air showed values of ~0.003-0.007 and ~0.07-0.12 S/m at 300 C and 500 C, respectively, depending upon the thermal processing schedule. The average flexure strength of the same BICUVOX membrane was measured using a ring-on-ring configuration, and this measurement showed flexural strengths as high as 159.3 MPa. This strength is ~92 % greater than previously reported values for BICUVOX membranes.
机译:铜掺杂钒酸铋(Bi_2Cu_(0.1)V_(0.9)O_(5.35),BICUVOX)是通过共沉淀法合成的,产生的均质细粒粉末的平均粒径约为0.45μm。将固结的BICUVOX粉末在空气中于625至800摄氏度之间的温度下烧结0-8小时。通过对所得横截面扫描电子显微镜图像进行立体分析,可以在所有条件下完成热处理程序和最终显微组织之间的相关性。通过这项工作,在675 C下进行了1 h的烧结,结果获得了BICUVOX陶瓷微结构,该陶瓷微结构显示出约97%的相对密度,平均晶粒尺寸为〜1.29μm。对于相同的密度,该处理条件比典型的烧结温度低约75-125 C,导致最终晶粒尺寸减小约5-10μm。根据热处理程序的不同,BICUVOX陶瓷在空气中的四点电导率测试分别表明在300 C和500 C时〜0.003-0.007和〜0.07-0.12 S / m的值。使用环上环结构测量同一BICUVOX膜的平均弯曲强度,该测量显示出高达159.3 MPa的弯曲强度。该强度比以前报道的BICUVOX膜的强度高约92%。

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