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Microstructure development in Nb3Sn(Ti) internal tin superconducting wire

机译:Nb3Sn(Ti)内锡超导线材的显微组织发展

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The authors have studied the phase formation sequences in a Nb3Sn 'internal tin' process superconductor. Heat treatments were performed to convert the starting materials of tin, Ti-Sn, copper and niobium, to bronze and Nb3Sn. Specimens were quenched at different points of the heat treatment, followed by metallography to identify the phases present and X-ray microtomography (XMT) to investigate the void volume and distribution. An unexpected observation of the microstructure development was the uphill diffusion of tin during the Cu-Sn reactive diffusion. Some defects likely to affect the superconducting performance of the wires were observed. Microscopy revealed the presence of a Ti-Sn intermetallic compound displacing the niobium filaments, and XMT revealed the formation of long pores in the longitudinal direction. Two types of pore formation mechanism, in addition to Kirkendall pores, are proposed. The phase and microstructure development suggests that low-temperature heat treatment (below 415 degrees C) will have significant influence on optimising the final superconducting properties.
机译:作者研究了Nb3Sn“内部锡”过程超导体中的相形成序列。进行热处理以将锡,Ti-Sn,铜和铌的起始原料转化为青铜和Nb3Sn。样品在热处理的不同点淬火,然后进行金相鉴定以鉴定存在的相,并用X射线显微照相术(XMT)研究空隙的体积和分布。观察到的微观结构变化是在Cu-Sn反应性扩散过程中锡的上坡扩散。观察到一些可能影响导线超导性能的缺陷。显微镜检查显示存在取代铌细丝的Ti-Sn金属间化合物,而XMT显示在纵向方向上形成了长孔。除了Kirkendall孔隙外,还提出了两种类型的孔隙形成机理。相和微观结构的发展表明,低温热处理(低于415摄氏度)将对优化最终超导性能产生重大影响。

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