首页> 外文期刊>Journal of Alloys and Compounds: An Interdisciplinary Journal of Materials Science and Solid-state Chemistry and Physics >Fabrication and characterization of Bi_(0.4)Te_(3.0)Sb_(1.6) thin films by flash evaporation method
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Fabrication and characterization of Bi_(0.4)Te_(3.0)Sb_(1.6) thin films by flash evaporation method

机译:Bi_(0.4)Te_(3.0)Sb_(1.6)薄膜的快速蒸发法制备与表征

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摘要

Bi_(0.4)Te_(3.0)Sb_(1.6) thin films on glass substrates are fabricated by a flash evaporation method. In order to enhance the transport properties of the thin films, annealing in argon ambient at atmospheric pressure is carried out for 1 h in the temperature range from 200 to 400 deg C. The structure of the thin films, in terms of homogeneous composition and crystallinity, is investigated by energy dispersive X-ray spectroscopy and X-ray diffraction, respectively. The microstructure of the thin films is examined using scanning electron microscopy. We confirm that as-deposited Bi_(0.4)Te_(3.0)Sb_(1.6) thin films have a mostly homogeneous structure except for a few extra stuck particles. At higher annealing temperatures, the crystallinity of the thin films is improved and the size of crystal grains increases to the same size as the film thickness. However, excessive high annealing temperatures cause porous thin films due to the evaporation of tellurium. The transport properties of the thin films, in terms of the electrical resistivity, the Seebeck coefficient and the thermoelectric power factor are determined at room temperature. By optimizing the annealing conditions, it is possible to obtain a high-performance thin film with a thermoelectric power factor of 12.2 mu W cm~(-1) K~(-2). We consider that the performance of the thin films is enhanced for optimized annealing because of reductions in the importance of grain boundary scattering.
机译:通过闪蒸法在玻璃基板上制备Bi_(0.4)Te_(3.0)Sb_(1.6)薄膜。为了增强薄膜的传输性能,在大气压的氩气环境中于200至400摄氏度的温度下进行1 h退火。薄膜的结构在均匀组成和结晶度方面分别通过能量色散X射线光谱法和X射线衍射法研究。使用扫描电子显微镜检查薄膜的微观结构。我们确认,沉积的Bi_(0.4)Te_(3.0)Sb_(1.6)薄膜具有几乎均匀的结构,除了一些额外的粘附颗粒。在较高的退火温度下,薄膜的结晶度得到改善,晶粒的尺寸增加到与膜厚度相同的尺寸。然而,过高的退火温度由于碲的蒸发而导致多孔薄膜。根据电阻率,塞贝克系数和热电功率因数,在室温下确定薄膜的传输特性。通过优化退火条件,可以获得热电功率因数为12.2μW cm〜(-1)K〜(-2)的高性能薄膜。我们认为,由于降低了晶界散射的重要性,薄膜的性能得以提高,可优化退火。

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