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Effect of heat treatment on the intermetallic layer of cold sprayed aluminum coatings on magnesium alloy

机译:热处理对镁合金冷喷涂铝层金属间层的影响

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Dense and thick pure aluminum coatings were deposited on AZ91D-T4 magnesium substrates using the cold spray process. Heat treatments of the as-sprayed samples were carried out at 400°C using different holding times. The feedstock powder, substrate and coating microstructures were examined using optical microscopy (OM), scanning electron microscopy (SEM), energy dispersive spectroscopy (EDS) as well as Vickers microhardness analysis. The results demonstrate that aluminum coatings having dense and uniform microstructure can be deposited successfully using a relatively large feedstock powder. It has been identified that the intermetallics Al_3Mg_2 (γ phase) and Mg_(17)Al_(12) (β phase) were formed at the coating/substrate interface during heat treatment. The growth rate of these intermetallics follows the parabolic law and the γ phase has a higher growth rate than the β phase. The thickness of the Mg_(17)Al_(12) and Al_3Mg_2 intermetallic layers has reached 83μm and 149μm, respectively. This result is almost 45% higher than what has been reported in the literature so far. This is attributed to the fact that T4 instead of as cast Mg alloy was used as substrate. In the T4 state, the Al concentration in the Mg matrix is higher, and thus intermetallic growth is faster as less enrichment is required to reach the critical level for intermetallic formation in the substrate. The AZ91D-T4 magnesium substrate contains single α phase with fine clusters/GP-zones which is considered beneficial for the intermetallic formation as well as the intimate contact between the coating/substrate interface and the deformed particles within the coating.
机译:使用冷喷涂工艺在AZ91D-T4镁基材上沉积致密而厚的纯铝涂层。喷涂样品的热处理是在400°C下使用不同的保温时间进行的。使用光学显微镜(OM),扫描电子显微镜(SEM),能量色散光谱(EDS)以及维氏显微硬度分析检查了原料粉末,基材和涂层的微观结构。结果表明,使用相对较大的原料粉末可以成功地沉积具有致密且均匀的微观结构的铝涂层。已经发现在热处理期间在涂层/基底界面处形成了金属间化合物Al_3Mg_2(γ相)和Mg_(17)Al_(12)(β相)。这些金属间化合物的生长速率遵循抛物线定律,并且γ相的生长速率高于β相。 Mg_(17)Al_(12)和Al_3Mg_2金属间层的厚度分别达到83μm和149μm。该结果比迄今为止文献中报道的结果高出近45%。这归因于以下事实:使用T4代替铸造的Mg合金作为基材。在T4状态下,Mg基体中的Al浓度较高,因此金属间化合物的生长更快,因为需要较少的富集才能达到在衬底中形成金属间化合物的临界水平。 AZ91D-T4镁基材包含具有细团簇/ GP区的单一α相,这被认为有利于金属间化合物的形成以及涂层/基材界面与涂层中变形颗粒之间的紧密接触。

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