This paper presents a non-destructive, ultrasonic technique to evaluate the quality of bonds betweensubstrates. Shear-horizontally polarized (SH) wave modes are investigated to infer the shearstiffness of bonds, which is necessarily linked to the shear resistance that is a critical parameter forbonded structures. Numerical simulations are run for selecting the most appropriate SH wavemodes, i.e., with higher sensitivity to the bond than to other components, and experiments are madefor generating-detecting pre-selected SH wave modes and for measuring their phase velocities. Aninverse problem is finally solved, consisting of the evaluation of the shear stiffness modulus of abond layer at different curing times between a metallic plate and a composite patch, such assemblybeing investigated in the context of repair of aeronautical structures.
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