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The coefficient of bond thermal expansion measured by extended x-ray absorption fine structure

机译:扩展的X射线吸收精细结构测得的键热膨胀系数

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The bond thermal expansion is in principle different from the lattice expansion and can be measured by correlation sensitive probes such as extended x-ray absorption fine structure (EXAFS) and diffuse scattering. The temperature dependence of the coefficient alpha(bond)(T) of bond thermal expansion has been obtained from EXAFS for CdTe and for Cu. A coefficient alpha(tens)(T) of negative expansion due to tension effects has been calculated from the comparison of bond and lattice expansions. Negative lattice expansion is present in temperature intervals where alpha(bond) prevails over alpha(tens); this real-space approach is complementary but not equivalent to the Gruneisen theory. The relevance of taking into account the asymmetry of the nearest-neighbours distribution of distances in order to get reliable bond expansion values and the physical meaning of the third cumulant are thoroughly discussed. (C) 2014 AIP Publishing LLC.
机译:粘结热膨胀在原理上不同于晶格膨胀,并且可以通过相关敏感探针(例如扩展X射线吸收精细结构(EXAFS)和扩散散射)进行测量。从EXAFS获得了CdTe和Cu的键热膨胀系数α(bond)(T)的温度依赖性。通过比较键和晶格膨胀,可以计算出由于张力效应而引起的负膨胀系数α(tens)(T)。负晶格膨胀存在于温度区间中,其中α(键)胜于alpha(十);这种实空间方法是互补的,但并不等同于格鲁内森理论。充分讨论了考虑距离的最近邻分布的不对称性以获得可靠的键扩展值的相关性以及第三种累积量的物理意义。 (C)2014 AIP Publishing LLC。

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