首页> 外文期刊>The Journal of Chemical Physics >Hybrid interfaces of poly(9,9-dioctylfluorene) employing thin insulating layers of CsF: A photoelectron spectroscopy study
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Hybrid interfaces of poly(9,9-dioctylfluorene) employing thin insulating layers of CsF: A photoelectron spectroscopy study

机译:使用CsF绝缘薄层的聚(9,9-二辛基芴)的杂化界面:光电子能谱研究

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The recent discovery that thin insulating layers inserted between organic layer and metal cathode can significantly improve performance and lifetime of organic-based light-emitting devices is the reason for detailed studies of related interfaces. In this work we' investigate the role of thin ( -5 A) interfacial layer of CsF between poly(9,9-dioctylfluorene) (PFO) polymer film and aluminum electrode. A number of sandwich-type interfaces prepared in situ have been studied using x;.ray photoelectron spectroscopy including CsF/poly(9,9-dioctylfluorene). Al/CsF/poly(9,9- dioctylfluorene), Al/CsF/Au, CsF/Al, CsF/AlxOy, and CsF/Au. We found that CsF does not decompose when in contact with polymer film. There is, however, evidence that for coverage higher than 3 A, molecules are oriented with the fluorine atom pointing downwards. Deposition of aluminum on such structures causes CsF to dissociate with cesium n-doping the polymer at the interface and fluorine likely reacting with aluminum to form A1F3. When deposited onto either a sputter-cleaned Al surface or Al with native oxide layer (Al;Oy), CsF also was found to dissociate at the interface but remain in the CsF form away from the Al surface. In the case of a clean Al surface, cesium left after decomposition resides at the interface, presumably in'the form of metal and metal oxide, whereas Lhere is evidence for cesium oxide only for the CsF/AlxOy interface. Thickness of the converted CsF layer has been found to be approximately 5 A in all cases where decomposition takes place. The lack of CsF decomposition observed for Au/CsF/PFO and CsF/ Au interfaces emphasizes the crucial role aluminum p.1ays in the whole process. The observed decomposition of CsF when in contact with Al and following n-doping of the surface region of PFO likely enhances injection of electrons into the organic layer, improving device performance. Since CsF dissociation is independent of the underlying material, the Al/CsF/emissive-material structure could be effective for almost all types of polymerlorganic-based electronic devices.
机译:最近发现在有机层和金属阴极之间插入薄绝缘层可以显着提高有机基发光器件的性能和寿命是对相关界面进行详细研究的原因。在这项工作中,我们研究了聚(9,9-二辛基芴)(PFO)聚合物薄膜和铝电极之间的CsF薄(-5 A)界面层的作用。使用包括CsF /聚(9,9-二辛基芴)的X射线光电子能谱研究了许多原位制备的夹心型界面。 Al / CsF /聚(9,9-二辛基芴),Al / CsF / Au,CsF / Al,CsF / AlxOy和CsF / Au。我们发现,CsF与聚合物薄膜接触时不会分解。但是,有证据表明,对于覆盖率高于3 A的分子,分子的取向是氟原子朝下。在这种结构上沉积铝会导致CsF与铯n掺杂解离界面处的聚合物,并且氟很可能与铝反应形成AlF3。当将CsF沉积到溅射清洗的Al表面或具有自然氧化物层的Al(Al; Oy)上时,在界面处也会解离,但仍保留在远离Al表面的CsF形式中。在干净的Al表面的情况下,分解后残留的铯可能以金属和金属氧化物的形式存在于界面处,而Lhere证明仅在CsF / AlxOy界面处存在氧化铯。已发现在所有发生分解的情况下,转换后的CsF层的厚度约为5A。 Au / CsF / PFO和CsF / Au界面缺乏CsF分解现象,这突出了铝p.1ays在整个过程中的关键作用。当与Al接触以及PFO表面区域进行n掺杂后,观察到的CsF分解可能会增强电子向有机层的注入,从而改善器件性能。由于CsF的解离与底层材料无关,因此Al / CsF /发射材料的结构对于几乎所有类型的高分子有机电子设备都可能有效。

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