Rain-induced removal of copper from apple leaves: Influence of rain properties and tank-mix adjuvants on deposit characteristics at the micro scale

摘要

Application of copper fungicides is an integrative component in the control of apple scab. As shown in the past, tank-mix adjuvants might reduce the rain-induced removal of active ingredients. The aims of this study were a) to characterize the impact of defined rain amount on the removal of Cu-oxychloride (Cu-Ox) and Cu-hydroxide (Cu-Hyd) from apple seedling leaves, b) to examine the influence of ethoxylated seed oil adjuvants on deposit properties at the micro scale and their possible influence in reducing the fungicide erosion from the leaves, and finally c) to evaluate the influence of previous adjuvant application on the rainfastness of copper ions. Losses of Cu-Hyd and Cu-Ox from seedling leaves exposed to 5 mm heavy rain reached almost 80% of the original Cu load. Wash-off extent of Cu-Ox could be reduced by using the rapeseed oil ethoxylate RSO 5 (47%), the linseed oil ethoxylate LSO 10 (47%), or the soybean oil ethoxylate SBO 10 (40%). However, in case of Cu-Hyd, none of the adjuvants was able to increase the tenacity of the copper on the leaves. Rainfall removed the bulky deposits and induced changes in the typical shape of the crystals. Furthermore, a reorganization of the spatial distribution of the remaining active ingredient (a.i.) was induced, which was very often embedded in a thin layer of adjuvants. In general, the adjuvants had a significant impact on droplet spread, whereas the area effectively covered with the a.i. was affected to a lesser extent. For both Cu-Hyd and Cu-Ox rewetting of the original deposit under controlled conditions resulted in an increased spread area but reduced the area effectively covered with Cu. Our results showed no clear relationship between the area covered by Cu ions and their adhesion to the surface, i.e. rainfastness. Finally, our studies indicated that previous spray treatments might influence the rain-induced removal of copper