首页> 外文期刊>Physical Review, B. Condensed Matter >Microstructural influence on critical currents and irreversibility line in melt-textured YBa2Cu3O7-x reannealed at high oxygen pressure - art. no. 104526
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Microstructural influence on critical currents and irreversibility line in melt-textured YBa2Cu3O7-x reannealed at high oxygen pressure - art. no. 104526

机译:在高氧气压力下重新退火的熔融织构YBa2Cu3O7-x对临界电流和不可逆线的显微组织影响-艺术。没有。 104526

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We present a study of flux pinning by in-plane partial dislocations in melt-textured grown YBa2Cu3O7/Y2BaCuO5 (123/211). The in-plane dislocations are generated by high oxygen pressure (HOP) postprocessing treatment as confirmed by transmission electron microscopy (TEM). In order to characterize the dislocation density and the perimeter to surface ratio (PSR) of the associated stacking faults a large number of TEM micrographs have been analyzed. We demonstrate that the evolution of the microstructure correlates with the oxygen absorbed by the samples during different HOP treatments. Two regimes of oxygenation activity are identified: first, the low oxygenation regime where the PSR of the stacking faults stays almost constant but the in-plane dislocation density is increased near the 123/211 interfaces and second, the high oxygenation regime where the stacking faults extend over the entire 123 matrix inducing a drastic enhancement of the dislocation density and a strong decrease in the PSR. Two contributions to the critical current density have been identified and quantified: the weak pinning and the correlated disorder pinning. We demonstrate that the correlated disorder comes from 123/211 interfaces and that this remains invariant with the HOP process. On the other hand, the weak pinning contribution is associated to the in-plane dislocations and this contribution strongly correlates with the HOP treatments. The temperature and field dependencies of the in-plane dislocations' contribution to the critical currents are in agreement with a pointlike single vortex pinning mechanism. Finally, we demonstrate that the dislocation pinning can be counterbalanced by wide stacking faults inducing a downward shift of the irreversibility line. [References: 43]
机译:我们目前对熔体织构生长的YBa2Cu3O7 / Y2BaCuO5(123/211)中的面内部分位错钉扎通量的研究。平面内位错是由高氧压(HOP)后处理产生的,这已由透射电子显微镜(TEM)证实。为了表征相关堆叠缺陷的位错密度和周长与表面积之比(PSR),已经分析了许多TEM显微照片。我们证明,在不同的HOP处理过程中,微观结构的演变与样品吸收的氧气有关。确定了两种氧合作用方式:第一,低氧合状态,其中堆垛层错的PSR几乎保持不变,但平面位错密度在123/211界面附近增加;第二,高氧合状态,其中堆垛层错延伸到整个123矩阵,导致位错密度急剧增加,PSR大大降低。已经确定并量化了对临界电流密度的两个贡献:弱钉扎和相关的无序钉扎。我们证明,相关的障碍来自123/211接口,并且这与HOP过程保持不变。另一方面,较弱的钉扎作用与面内脱位有关,而这种作用与HOP治疗密切相关。平面内位错对临界电流的贡献的温度和场依赖性与点状单涡旋钉扎机制一致。最后,我们证明位错钉扎可以通过引起不可逆线向下移动的宽叠层错位来抵消。 [参考:43]

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