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首页> 外文期刊>Physica, B. Condensed Matter >Influence of surfactant Ag on the structure of annealing Ni70Co30/Cu multilayers by X-ray reflection anomalous fine structure and X-ray absorption spectroscopy
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Influence of surfactant Ag on the structure of annealing Ni70Co30/Cu multilayers by X-ray reflection anomalous fine structure and X-ray absorption spectroscopy

机译:表面活性剂Ag通过X射线反射异常精细结构和X射线吸收光谱对Ni70Co30 / Cu多层膜退火结构的影响

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摘要

We performed X-ray reflection anomalous fine structure and X-ray absorption spectroscopy measurements to investigate the influence of Ag as a surfactant on the annealing Ni70Co30/Cu multilayer for the first time. Interfacial intermixing and silver diffusion levels were quantified at the atomic level. During the deposition, a 6 A thick intermixing region exists at the Cu/Ni70Co30 interface while the Ni70Co30/Cu interface is sharp for the un-doped and the Ag-doped multilayers. After 285 degrees C annealing, the two multilayers display different thermal behaviors. Severe diffusion occurs at the Cu/Ni70Co30 and Ni70Co30/Cu interface's of the un-doped multilayer. However, of these the Ag-doped multilayer do not change significantly, indicating that the addition of silver can suppress interfacial intermixing after annealing. The Ag atoms in the Ag-doped multilayer have diffused into some parts Of Ni70Co30 layer while do not exist at the interfaces during the deposition. After 285 degrees C annealing, the Ag atoms diffused into the whole Ni70Co30 layer as well as some parts of the Cu layer. The X-ray absorption spectroscopy measures show that Ni atoms and Cu atoms occupy the interfacial positions in the un-doped multilayer. The addition of silver also do not change the FCC lattice of Co, Ni and Cu, but decrease the amplitude of the Ni and the Co K edge EXAFS profiles, suggesting that Ag atoms do diffuse into the Ni70Co30 layer. (c) 2006 Elsevier B.V. All rights reserved.
机译:我们进行了X射线反射异常精细结构和X射线吸收光谱测量,以首次研究作为表面活性剂的Ag对Ni70Co30 / Cu多层退火的影响。界面混合和银扩散水平在原子水平上定量。在沉积过程中,Cu / Ni70Co30界面处存在6 A厚的混合区域,而Ni70Co30 / Cu界面对于未掺杂和Ag掺杂的多层来说很尖锐。在285摄氏度退火之后,两个多层显示出不同的热行为。严重扩散发生在未掺杂多层的Cu / Ni70Co30和Ni70Co30 / Cu界面处。然而,在这些Ag掺杂的多层中,没有明显变化,表明添加银可以抑制退火后的界面混合。 Ag掺杂多层膜中的Ag原子扩散到Ni70Co30层的某些部分,而在沉积过程中不存在于界面处。经过285摄氏度的退火后,Ag原子扩散到整个Ni70Co30层以及部分Cu层中。 X射线吸收光谱法测量表明,Ni原子和Cu原子占据了未掺杂多层中的界面位置。银的添加也不会改变Co,Ni和Cu的FCC晶格,但会减小Ni和Co K边缘EXAFS轮廓的幅度,表明Ag原子确实扩散到Ni70Co30层中。 (c)2006 Elsevier B.V.保留所有权利。

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