Study of the adsorption reactions of thiophene on Cu(I)/HY-Al _2O_3 by fourier transform infrared and temperature- programmed desorption: Adsorption, desorption, and sorbent regeneration mechanisms

摘要

This work mainly involved the investigation of the adsorption of thiophene on Cu(I)-supported HY-Al_2O_3. It demonstrated a high sulfur capacity of 10 mg sulfur/g sorbent when the HY/Al_2O_3 mass ratio was 3, loaded with 12% copper, calcined at 550 °C, and tested at ambient temperature. In situ Fourier transform infrared (FTIR) and temperature-programmed desorption (TPD) results indicated that the adsorption mechanisms on Cu(I)/HY-Al_2O_3 primarily were π-complexation and sulfur-adsorbent (S-M; σ) bonds. Pyridine-FTIR showed the total weak Lewis acid contribution to the Cu(I)/HY-Al _2O_3 adsorption desulfurization performance.