A NOVEL LUMPED-PARAMETER MODEL OF CROSSTALK BETWEEN VIAS IN HIGH-SPEED PCBS

摘要

The method for lumped-parameter via crosstalk ( LPVC) model development is proposed in this letter. Good agreement between the full-wave modeling and the physics-based via simulation has been achieved in frequency-domain. This model is easier to construct and allows researchers to better understand the impact of each parameter on crosstalk between via than former models. Analysis results show that, both power/ground ( P/G) geometry and via distance have significant influences on crosstalk between vias on high-speed printed circuit board ( PCB). (C) 2016 Wiley Periodicals, Inc.