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Directed assembly of a cylinder-forming diblock copolymer: Topographic and chemical patterns

机译:圆柱状二嵌段共聚物的定向组装:形貌和化学模式

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Using simulations of a coarse-grained model, we examine the ability of topographic and chemical patterns to direct the self-assembly of thin films of copolymers into a defect-free array of vertical cylinders. The topographic pattern is a trench where the diblock is confined, whereas the chemical pattern consists of spots that interact preferentially with the minority block. The self-assembly process is described with Monte Carlo simulations of the standard model of block copolymers. While fully three-dimensional, the simulated systems can include over a hundred domains. By analyzing top views and cross sections of thin films, it is possible to determine the degree of ordering and the properties of individual domains. First, the influence of confinement on ordering perfection is examined. By focusing on the influence of trench width and sidewall selectivity, one can identify conditions that yield defect-free arrays with a high reliability and for which domains exhibit a high degree of uniformity across the trench. Second, we consider chemical patterns. While patterns matching the block copolymer morphology and characteristic dimensions yield defect-free self-assembly, we study the tolerance of directed self-assembly against deviations from this optimal case. We first explore the effect of a mismatch between the spacing of the pattern and the diblock characteristic dimensions, and then we examine the interpolation of domains on an incomplete pattern, where half of the rows are missing. By introducing placement error in the position of the spots, we assess to what extent the diblock can rectify the noise of a substrate pattern. The results of simulations are discussed in the context of a variety of experimental observations.
机译:使用粗粒度模型的模拟,我们检查了地形和化学图案将共聚物薄膜的自组装引导到垂直圆柱体的无缺陷阵列中的能力。地形图是限制二嵌段的沟槽,而化学图案由优先与少数嵌段相互作用的斑点组成。通过嵌段共聚物标准模型的蒙特卡洛模拟描述了自组装过程。虽然完全是三维的,但是模拟系统可以包含一百多个域。通过分析薄膜的俯视图和横截面,可以确定有序度和各个域的性质。首先,研究了限制对有序完善的影响。通过关注沟槽宽度和侧壁选择性的影响,可以确定产生具有高可靠性的无缺陷阵列并且其畴在整个沟槽上表现出高度均匀性的条件。其次,我们考虑化学模式。虽然与嵌段共聚物形态和特征尺寸相匹配的图案可产生无缺陷的自组装,但我们研究了定向自组装对这种最佳情况下的偏离的耐受性。我们首先探讨图案间距与二嵌段特征尺寸之间不匹配的影响,然后研究不完整图案上域的插值,其中缺少一半行。通过在斑点的位置引入放置误差,我们评估了二嵌段能够在多大程度上校正衬底图案的噪声。在各种实验观察的背景下讨论了模拟结果。

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