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Design and synthesis of new polymeric materials for organic nonvolatile electrical bistable storage devices: Poly(biphenylmethylene)s

机译:用于有机非易失性双稳态电存储设备的新型聚合物材料的设计和合成:聚(联苯亚甲基)

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摘要

The synthesis of new polymers, poly(biphenylmethylene)s, derived from bistriflates of bisphenol-type monomers, by Ni(0)-mediated polymerization has been presented. These polymers are interesting because of the nature of the polymer backbone that contains biphenyl units separated by substituted methylene units. The solubility, mechanical properties, and electrical properties of the polymers can be altered by proper selection of the methylene substituents. Polymers and oligomers had molecular weights ranging from 2000 to 15 000 g/mol, as measured by calibrated gel permeation chromatography (GPC), though light scattering and MALDI studies indicate that GPC tends to underestimate the molecular weights of these polymers. The polymers have T-g's between 230 and 300 ° C and have thermal stabilities ranging from 400 to 493 ° C. Thermally cross-linkable, 4-phenylethenyl end-capped oligomers were synthesized and fabricated into thin-film electronic devices, and preliminary results on their characterization are discussed. The unique structure of the polymer backbone makes these materials potentially interesting in electrical applications where large-band-gap polymers with good electron/hole mobility and good thermal and oxidative stability are required.
机译:提出了由Ni(0)介导的聚合反应,从双酚型单体的双三氟甲磺酸酯衍生出的新聚合物,聚(联苯亚甲基)。这些聚合物是令人感兴趣的,因为聚合物主链的性质包含被取代的亚甲基单元分隔的联苯单元。的溶解性,机械特性,和聚合物的电性能可以通过亚甲基的取代基的合适选择而改变。聚合物和低聚物的分子量范围为2000至15000 g / mol(通过校准凝胶渗透色谱法(GPC)测量),尽管光散射和MALDI研究表明GPC往往低估了这些聚合物的分子量。该聚合物的T-g在230至300之间。 C,热稳定性为400至493° C.合成了可热交联的4-苯基乙烯基封端低聚物,并将其制成薄膜电子器件,并讨论了其表征的初步结果。聚合物主链的独特结构使这些材料在电气应用中具有潜在的吸引力,在电气应用中,需要具有良好的电子/空穴迁移率以及良好的热和氧化稳定性的宽带隙聚合物。

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