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首页> 外文期刊>Electrochimica Acta >Insights into electrodeposition process of nickel from ammonium chloride media with speciation analysis and in situ synchrotron radiation X-ray imaging
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Insights into electrodeposition process of nickel from ammonium chloride media with speciation analysis and in situ synchrotron radiation X-ray imaging

机译:通过形态分析和原位同步辐射X射线成像洞察氯化铵介质中镍的电沉积过程

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The electrodeposition processes of nickel in ammonium chloride media were studied in combination of speciation analysis and in situ synchrotron radiation X-ray imaging. The X-ray absorption spectra indicated that the nickel(II) species present an octahedral configuration independent on aqueous pH. The UV-vis spectra and fraction-pH diagram showed that the dominant species is Ni(H2O)(6)(2+), Ni (NH3)(m)(H2O)(6) (2+)(m)(m = 2, 3 and 4) and Ni(NH3)(6)(2+) in the electrolytes of pH 3, 7.5 and 10, respectively, and chloride ions are not bonded to the inner coordination sphere of nickel species. The electrochemical behaviors and nucleation mechanism of nickel(II) species are dependent on the solution pH and species. The deposited nickel morphology and bubble evolution at the interface of electrode/electrolyte were clearly elucidated by the X-ray real-time images. The results indicate that the inner coordination sphere of nickel species can induce the morphology, growth and adherence processes of the deposited nickel. The competition process between nickel reduction and hydrogen evolution has also been discussed at the different applied potentials. The mixed coordination species and the higher applied potentials are beneficial for the formation of the well-adhered and dense nickel deposits. (C) 2016 Elsevier Ltd. All rights reserved.
机译:结合形态分析和原位同步辐射X射线成像研究了镍在氯化铵介质中的电沉积过程。 X射线吸收光谱表明,镍(II)物质呈现出与水相pH无关的八面体构型。紫外可见光谱和pH值图表明,主要物质为Ni(H2O)(6)(2 +),Ni(NH3)(m)(H2O)(6)(2 +)(m)(m分别在pH为3、7.5和10的电解质中分别包含2、3和4)和Ni(NH3)(6)(2+),并且氯离子未键合到镍物种的内部配位球上。镍(II)物种的电化学行为和成核机理取决于溶液的pH和物种。 X射线实时图像清楚地阐明了在电极/电解质界面处沉积的镍形态和气泡的演变。结果表明,镍物种的内部配位球可以诱导沉积镍的形貌,生长和附着过程。还讨论了在不同的应用电势下镍还原与氢释放之间的竞争过程。混合的配位物质和较高的应用电势有利于形成附着力强的致密镍镀层。 (C)2016 Elsevier Ltd.保留所有权利。

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