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首页> 外文期刊>Electrochimica Acta >Electrochemical deposition of zinc from deep eutectic solvent on barrier alumina layers
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Electrochemical deposition of zinc from deep eutectic solvent on barrier alumina layers

机译:来自深共熔溶剂的锌在阻挡氧化铝层上的电化学沉积

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摘要

The direct use of high-ordered porous templates of anodic aluminium oxide for formation of nanostructures via electrochemical deposition is difficult because the presence of the of barrier alumina layer in the bottom of pores. In this paper, zinc electrodeposition from a solution of ZnCl2 in a choline chloride/ethylene glycol eutectic mixture on dense alumina layers of different thicknesses was studied. In a potentiostatic regime, the deposition on a barrier layer was found to be hardly possible even when the layer is a native alumina film (about 2 nm thick). Choline and ethylene glycol form an adsorbed stable layer at the alumina/electrolyte interface and thereby block the access of zinc chloride anions to the electrode.
机译:由于孔底部存在阻挡氧化铝层,因此难以直接使用阳极氧化铝的高级多孔模板通过电化学沉积形成纳米结构。本文研究了在不同厚度的致密氧化铝层上由氯化锌/乙二醇共熔混合物中的ZnCl2溶液电沉积锌的方法。在恒电位状态下,发现即使在阻挡层是天然氧化铝膜(约2nm厚)的情况下也几乎不可能沉积在阻挡层上。胆碱和乙二醇在氧化铝/电解质界面处形成稳定的吸附层,从而阻止氯化锌阴离子进入电极。

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