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A stability comparison of redox-active layers produced by chemical coupling of an osmium redox complex to pre-functionalized gold and carbon electrodes

机译:chemical氧化还原络合物与预功能化的金和碳电极化学偶联产生的氧化还原活性层的稳定性比较

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摘要

The production of stable redox active layers on electrode surfaces is a key factor for the development of practical electronic and electrochemical devices. Here, we report on a comparison of the stability of redox layers formed by covalently coupling an osmium redox complex to pre-functionalized gold and graphite electrode surfaces. Pre-treatment of gold and graphite electrodes to provide surface carboxylic acid groups is achieved via classical thiolate self-assembled monolayer formation on gold surfaces and the electro-reduction of an in situ generated aryldiazonium salt from 4-aminobenzoic acid on gold, glassy carbon and graphite surfaces. These surfaces have been characterized by AFM and electrochemical blocking studies. The surface carboxylate is then used to tether an osmium complex, [Os(2,2'-bipyridyl){sub}2(4-aminomethylpyridine)Cl]PF{sub}6, to provide a covalently bound redox active layer, E{sup}0' of 0.29 V (vs. Ag/AgCl in phosphate buffer, pH 7.4), on the pre-treated electrodes. The aryldiazonium salt-treated carbon-based surfaces showed the greatest stability, represented by a decrease of <5% in the peak current for the Os(II/III) redox transition of the immobilized complex over a 3-day period, compared to a decrease of 19% and 14% for the aryldiazonium salt treated and thiolate treated gold surfaces, respectively, over the same period.
机译:在电极表面上产生稳定的氧化还原活性层是开发实用的电子和电化学设备的关键因素。在这里,我们报告了通过将red氧化还原络合物共价偶联至预功能化的金和石墨电极表面而形成的氧化还原层稳定性的比较。金和石墨电极的预处理以提供表面羧酸基团是通过在金表面上经典的硫醇盐自组装单层形成以及在金,玻璃碳和碳上从4-氨基苯甲酸电还原原位生成的芳基重氮盐来实现的。石墨表面。这些表面已通过AFM和电化学阻断研究进行了表征。然后将表面羧酸盐用于束缚complex络合物[Os(2,2'-联吡啶基){sub} 2(4-氨基甲基吡啶)Cl] PF {sub} 6,以提供共价键合的氧化还原活性层E {预处理电极上的0.20 V(vs。磷酸盐缓冲液中的Ag / AgCl,pH 7.4)的0}。芳基重氮盐处理过的碳基表面表现出最大的稳定性,与固定化配合物相比,在3天的时间内,固定化复合物的Os(II / III)氧化还原转变的峰值电流降低了5%以下。芳基重氮盐处理过的表面和硫醇盐处理过的金表面在同一时期分别下降了19%和14%。

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