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首页> 外文期刊>Asian Journal of Chemistry: An International Quarterly Research Journal of Chemistry >Synthesis, Characterization and Electrochemical Studies on the Interaction Mechanism of Ternary Cu(II) Complex with DNA
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Synthesis, Characterization and Electrochemical Studies on the Interaction Mechanism of Ternary Cu(II) Complex with DNA

机译:三元Cu(II)配合物与DNA相互作用机理的合成,表征和电化学研究

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A new ternary complex of Cu(II) with Schiff base 2-hydroxy-1-naphthaldehyde-glycine (KHL) and 8-hydroxyquinoline (OHQ) was synthesized and characterized by elemental analysis, IR, TG-DTG and molar conductance. The composition of the complex was confirmed to be [Cu(L)(OHQ)] · 2H2O. The fundamental electrochemical characteristics of the Cu(II) complex have been studied and me interaction of the copper complex and DNA was also studied by cyclic voltammetry and fluorescence spectra. The results of the cyclic voltammetry showed that the Cu(II) complex had an oxidation peak wim the oxidation potential at -0.394 V. After the DNA was added, the peak current declined with the peak potential shifting positively. This suggested mat the complex combined with DNA in the form of intercalative binding, which was also proved by the fluorescence analysis. The binding ratio between me Cu(II) ternary complex and DNA was calculated to be 1:1 and the binding constant was 4.6 x 10~2 L mol~(-1).
机译:合成了一种新的Cu(II)与席夫碱2-羟基-1-萘醛-甘氨酸(KHL)和8-羟基喹啉(OHQ)的三元配合物,并通过元素分析,IR,TG-DTG和摩尔电导进行了表征。确认该络合物的组成为[Cu(L)(OHQ)]·2H2O。研究了Cu(II)配合物的基本电化学特性,并通过循环伏安法和荧光光谱研究了铜配合物与DNA的相互作用。循环伏安法的结果表明,Cu(II)配合物在-0.394 V处有一个氧化峰,氧化电位大。添加DNA后,峰电流下降,峰电位正移。这表明复合物以嵌入结合的形式与DNA结合,这也通过荧光分析证实。 Cu(II)三元配合物与DNA的结合比经计算为1:1,结合常数为4.6 x 10〜2 L mol〜(-1)。

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