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首页> 外文期刊>ACS applied materials & interfaces >Cross-Linkable Hole-Transport Materials Improve the Device Performance of Perovskite Light-Emitting Diodes
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Cross-Linkable Hole-Transport Materials Improve the Device Performance of Perovskite Light-Emitting Diodes

机译:可交联的空穴传输材料改善了钙钛矿发光二极管的器件性能

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摘要

Hybrid organic/inorganic perovskites are promising candidate materials for use in photovoltaic applications. More recently, they have also become highly attractive as active materials for other optoelectronic devices, including lasers, light-emitting diodes, and photodetectors. Nevertheless, difficulties in forming continuous and uniform films and the existence of a charge-injection barrier between the perovskite layer and the electrodes have hindered the development of high-performance perovskite light-emitting diodes (PeLEDs). In this study, a cross-linked hole-transport layer (HTL) is introduced to improve the hole-injection efficiency of PeLEDs. Furthermore, this layer simultaneously facilitates the formation of smooth perovskite layers, presumably because of the different surface energies. More interestingly, the HTL also exhibits strong solvent effects on the device performance. When the processing solvent for fabricating the HTLs is changed from chlorobenzene to N,N-dimethylformamide (DMF), the perovskite layer becomes more uniform and continuous, leading to better surface coverage and higher device efficiency, presumably because DMF has strong affinity toward the perovskite precursors. The approach presented herein could become a general method for decreasing the hole-injection barrier of PeLEDs and, eventually, lead to higher device performance.
机译:混合的有机/无机钙钛矿是有前途的候选材料,可用于光伏应用。最近,它们还作为用于其他光电子器件的活性材料而高度吸引人,这些光电子器件包括激光器,发光二极管和光电探测器。然而,在形成连续且均匀的膜方面的困难以及钙钛矿层与电极之间存在电荷注入阻挡层阻碍了高性能钙钛矿发光二极管(PeLED)的发展。在这项研究中,引入了一种交联的空穴传输层(HTL)以提高PeLED的空穴注入效率。此外,大概由于不同的表面能,该层同时促进了光滑钙钛矿层的形成。更有趣的是,HTL还对器件性能表现出强烈的溶剂作用。当将用于制造HTL的加工溶剂从氯苯改为N,N-二甲基甲酰胺(DMF)时,钙钛矿层变得更加均匀和连续,从而导致更好的表面覆盖率和更高的器件效率,这可能是因为DMF对钙钛矿具有很强的亲和力前体。本文提出的方法可能成为降低PeLED的空穴注入势垒的通用方法,并最终导致更高的器件性能。

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