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Laser Direct Writing Process for Making Electrodes and High-k Sol-Gel ZrO2 for Boosting Performances of MoS2 Transistors

机译:激光直写工艺用于制造电极和高k Sol-Gel ZrO2以提高MoS2晶体管的性能

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摘要

A series of two-dimensional (2D) transition metal dichalcogenides (TMDCs), including molybdenum disulfide (MoS2), can be attractive materials for photonic and electronic applications due to their exceptional properties. Among these unique properties, high mobility of 2D TMDCs enables realization of high-performance nanoelectronics based on a thin film transistor (TFT) platform. In this contribution, we report highly enhanced field effect mobility (mu(eff) = 50.1 cm(2)/(V s), similar to 2.5 times) of MoS2 TFTs through the sol-gel processed high-k ZrO2 (similar to 22.0) insulator, compared to those of typical MoS2/SiO2/Si structures (mu(eff) = 19.4 cm(2)/(V s)) because a high-k dielectric layer can suppress Coulomb electron scattering and reduce interface trap concentration. Additionally, in order to avoid costly conventional mask based photolithography and define the patterns, we employ a simple laser direct writing (LDW) process. This process allows precise and flexible control with reasonable resolution (up to similar to 10 nm), depending on the system, and enables fabrication of arbitrarily patterned devices. Taking advantage of continuing developments in laser technology offers a substantial cost decrease, and LDW may emerge as a promising technology.
机译:一系列的二维(2D)过渡金属二硫化碳(TMDC),包括二硫化钼(MoS2),由于其卓越的性能而成为光子和电子应用的有吸引力的材料。在这些独特的特性中,二维TMDC的高迁移率使基于薄膜晶体管(TFT)平台的高性能纳米电子学得以实现。在这项贡献中,我们报告了通过溶胶凝胶处理的高k ZrO2(类似于22.0),MoS2 TFT的场效应迁移率大大提高(mu(eff)= 50.1 cm(2)/(V s),类似于2.5倍) )绝缘体,而不是典型的MoS2 / SiO2 / Si结构(mu(eff)= 19.4 cm(2)/(V s)),因为高k介电层可以抑制库仑电子散射并降低界面陷阱浓度。另外,为了避免昂贵的基于常规掩模的光刻并定义图案,我们采用了简单的激光直接写入(LDW)工艺。根据系统的不同,此过程可以以合理的分辨率(最大类似于10 nm)进行精确而灵活的控制,并可以制造任意图案的器件。利用激光技术的不断发展,可以显着降低成本,LDW可能会成为有前途的技术。

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