Use of silicon as the heating element of the microsoldering irons

摘要

Considered is the idea of using the silicon diode structures as heating element of microsoldering iron for soldering of the electronic components to the multilayer printed circuits boards. The advantages of the silicon-based heating element and of the selected method of measurement of the iron tip temperature are the possibility of high accuracy of the thermal energy input, as well as the reproducibility of the high soldering quality due to perfect temperature control and cooling of soldered partsunder pressure of the iron tip.