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首页> 外文期刊>Физикаи химия обработки материалов >Distribution of AL, Ti, V atoms implanted into polycrystalline copper by means of ion mixing under irradiation with polyenergetic beam of Ar ions
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Distribution of AL, Ti, V atoms implanted into polycrystalline copper by means of ion mixing under irradiation with polyenergetic beam of Ar ions

机译:Ar离子多能束辐照下通过离子混合注入多晶铜的Al,Ti,V原子分布

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摘要

Near the surface layers of polycrystalline Cu werealloyed with Al, Ti and V atoms by ion mixing method underirradiation with 10 keV Ar~+ ions. An analysis of thecomposition of modified layers shows that the most efficienceway of the alloying is simultaneous implantation of Al, Ti or Ai,Ti, V atoms. Formation of Ti_3Al, TiA1_3 intermetallides innear the surface layers occurring in these cases, leads tosignificant strengthening the surface. A selective penetration of Tiatoms (<=0.001 at. percent) beneath the surface up to 1 #mu#m has been found.
机译:在10 keV Ar〜+离子辐照下,通过离子混合法在多晶Cu表面附近用Al,Ti和V原子合金化。对改性层组成的分析表明,合金化的最有效途径是同时注入Al,Ti或Al,Ti,V原子。在这种情况下,在表面层附近形成Ti_3Al,TiAl_3金属间化物,导致表面明显增强。已经发现Tiatoms(<= 0.001 at。%)在表面以下的选择性渗透高达1#μm。

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