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Numerical Simulation of Temperature Field and Solidification Morphologies of Copper Alloy by Vacuum Continuous Casting

机译:真空连续铸造铜合金温度场和凝固形态的数值模拟

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摘要

The purpose of this study is to predict the morphologies of the solidification process for copper alloys by vacuum continuous casting (VCC) process. In different casting speed (60~90 mm/min) and the pouring temperature (1100~1200℃), the numerical simulation system could effectively predict temperature distribution, solid fraction and grain growth patterns for copper alloy solidification process. In numerical simulation aspect, finite difference method (FDM) and cellular automaton (CA) model were utilized to solve the numerical calculations of the macro-temperature field, micro-nucleation and grain growth of copper alloy respectively. From the observed simulation results, the grain morphology has a change from axial to axial-radial growths as increasing casting speed, and has a change from axial-radial to axial growths as increasing pouring temperature. The cast grain morphology simulated by CAFD model had a good correspondent to the result of actual casting experiment.
机译:这项研究的目的是通过真空连续铸造(VCC)工艺来预测铜合金的凝固工艺形态。在铸造速度(60〜90 mm / min)和浇注温度(1100〜1200℃)下,数值模拟系统可以有效预测铜合金凝固过程的温度分布,固相分数和晶粒长大规律。在数值模拟方面,利用有限差分法(FDM)和元胞自动机(CA)模型分别求解了铜合金的宏观温度场,微核化和晶粒长大的数值计算。从观察到的模拟结果来看,随着浇铸速度的提高,晶粒形貌从轴向向轴向径向生长变化,并且随着浇铸温度的增加从轴向向径向径向生长变化。 CAFD模型模拟的铸造晶粒形态与实际铸造实验结果吻合良好。

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