A reduction in the size of surface-mountable passive devices from current 0603 to 0402 is expected as electrical appliances are miniaturized. Flexible printed circuits (FPCs) are used in electrical appliances equipped with three-dimensional wiring boards on which various surface-mount devices (SMDs) are soldered. With this being the situation, we established a series of constituent technologies from pattern designing to reflow soldering processes to achieve the mounting of 0402-sized SMDs on FPCs.
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