Development of Micro-Electro-Mechanical System Technology for High-Power Light-Emitting Diode Applications

摘要

This paper describes how to introduce the micro-electro-mechanical system (MEMS) technology to the LEDs fabrication process for high-power LEDs application. It contains the wafer bonding, electroplating, mirror processing and surface roughening techniques. Using these MEMS technologies, the epitaxial growth substrate can be replaced by the transparent substrate or the substrate with mirror and high thermal dissipassion. It can result in LEDs with high power and high efficiency for the applications of backlight and solid state lighting.