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首页> 外文期刊>電子情報通信学会技術研究報告. 機構デバイス. Electromechanical Devices >Effect of Hardness on Wear and Abrasion Resistance of Silver Plating on Copper Alloy
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Effect of Hardness on Wear and Abrasion Resistance of Silver Plating on Copper Alloy

机译:硬度对铜合金镀银层耐磨性的影响

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摘要

This study is aimed at clarifying the mechanism of wear process for Ag plating with different hardness. The samples of Ag plating on Cu alloys were prepared as coupon and embossment specimens, which simulated terminal contacts. During the sliding test, the contact resistance and the friction coefficient versus sliding distance were measured. The surface observation, surface roughness and worn volume of the Ag films after wear tests were investigated. As results, the hard Ag plating film (120 Hv) exhibited higher contact resistance comparing to the soft Ag plating film (80 Hv). The soft Ag film delivered a larger wear scar on embossment and wider wear trace on coupon specimens compared to the hard one. The overall worn volume of hard Ag film was less than that of soft Ag film, which can be attributed to the fine crystalline structure on hard Ag. Moreover, the observation of tribofilms formed on the Ag films after wear tests suggested that a mixed-type of adhesive and abrasive wears occurred for both of soft and hard Ag films. Furthermore, the hard Ag plating exhibited longer stable region of friction coefficient than the soft one in a linear oscillating fretting test, indicating an enhanced fretting corrosion resistance.
机译:本研究旨在阐明不同硬度的银镀层的磨损过程机理。将Cu合金上的Ag镀层样品制备为试样和压纹样品,以模拟端子接触。在滑动测试期间,测量了接触电阻和摩擦系数与滑动距离的关系。研究了磨损试验后Ag膜的表面观察,表面粗糙度和磨损量。结果,与软Ag镀膜(80Hv)相比,硬Ag镀膜(120Hv)表现出更高的接触电阻。与坚硬的Ag薄膜相比,柔软的Ag薄膜在压纹上产生更大的磨损痕迹,而在试样上的磨损痕迹更宽。硬银膜的总磨损量小于软银膜的磨损量,这可以归因于硬银上的精细晶体结构。此外,对磨损试验后在Ag膜上形成的摩擦膜的观察表明,软和硬Ag膜均发生了混合型的粘合剂和磨料磨损。此外,在线性振荡微动试验中,硬质Ag镀层的摩擦系数稳定区域长于软质Ag镀层,表明抗微动磨损性增强。

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