Multi-physics Coupling Simulation in the Design of Thermal Overload Relay

摘要

Thermal Overload Relay is a typical product under multi-physics coupling condition. The principle is that bimetal deflects under the effect of electrical, thermal and mechanical, tripping the mechanism till a threshold. This article is to introduce a method of using multi-physics coupling simulation to calculate the bimetal temperature distribution in both transient and steady, and the related bimetal deflection with comparison test results. The method makes it easier and more precise to get bimetal temperature distribution and bimetal deflection, especially when winded by heater, decreases the design cycle time and cost.