Build-up PCBs with via holes drilled by laser

摘要

A new multilayer build-up PCB system has been developed using micro via holes drilled by a high-peak, short-pulse CO{sub}2 laser. The circuits are formed by etching copper-clad laminate. The via holes are plated. Test products survived componentmounting and environmental stress testing and other reliability tests, maintaining acceptably low resistance values across through and via holes and high insulation resistance between layers. The new PCB technology supports finer conductor patterns andhigher component mounting densities than multilayer boards with drilled through holes with fewer layout constraints and shorter signal lines. The PCBs are suited to handheld electronic equipment and other compact and lightweight applications.