The need to make the electronic equipment multi-functional and smaller has drastically changed the printed wiring hoards in their ever expanding global market. Up-graded LSI, compact and higher functional package such as CSP/BGA (Chip Scale/Size Package)/(Ball Grid Array) and changes in the mounting technology have required "Build-up PWB" to achieve HDI (High Density Interconnection) that is expanding rapidly. This paper explains characteristics of future PWB materials required from the trend of LSI package and PWB design, and introduces products and technologies that will be newly developed.
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机译：对于电子设备的多功能化和小型化的需求已经极大地改变了其不断扩展的全球市场中的印刷线路板。升级的LSI，紧凑且功能更高的封装（例如CSP / BGA（芯片级/尺寸封装）/（球栅阵列））和安装技术的变化要求“ Building PWB”以实现HDI（高密度互连）正在迅速扩大。本文解释了LSI封装和PWB设计趋势所要求的未来PWB材料的特性，并介绍了将要开发的产品和技术。
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