In current demand for printed wiring boards (PWBs), greatest attention is focused on two aspects: high-density packaging technology, accompanying the advancement of semiconductor packages; and environment-friendliness, with an emphasis on lead-free and halogen-tree materials and the regulation of volatile organic compounds (VOCs). In the field of PWB materials, the shift to the use of various halogen-free materials is progressing at a rapid pace.Toshiba has developed halogen-free FR-4 (TLC-555), whose usage started in the PC field; halogen-free resin-coated foil (RCF) (TLD-152), for use in laser via buildup and multilayer PWBs; and high glass transition temperature (Hi-Tg) halogen-free FR-4 (TLC-552Y), which is suitable for module and package substrates.
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