Thermal Analysis of Small-Scale Capillary Pumped Loop Imitates Groove Heat Pipe Inner Structure

摘要

The CPL is a high efficiency two-phase heat transfer device using the phase change of working fluid to transport heat from evaporator to condenser; it's a cyclic circulation pumped by capillary force. Since a CPL does not need any other mechanical device such as pump, it might be used for the thermal management of high power electronic component on spacecraft. This study presents thermal analysis of a small scale CPL with and without reservoir. The shape of evaporator and the porous structure uses semi-arc instead of square and cylinder structures. Experimental results also showed that CPL could remove 110W and keep the CPU temperature at 80℃. For a CPL with or without reservoir, the deviation values of the loop resistance R{sub}(loop) and the system resistance R{sub}(sys) are 26.7% and 14%, respectively. The results show the loop with reservoir results in a lower thermal resistance.