Titanium and titanium nitride (TiN) thin films are widely used in semiconductor fabrication, and generally these films are built by sputtering with high purity titanium sputtering target. The sputtering target surface is prepared by machining: a lathe is commonly used and this gives unstable sputtering performance to the sputtering target. Undesirable damage layer is introduced to the sputtering target surface by the machining. Therefore, in order to sputter off the damage layer and to have stable sputtering performance, burn-in is applied. However, this process takes certain time and deteriorates production throughput. Nikko Materials Co., Ltd developed "Sputter Ready" (SR) titanium target which can reduce burn-in time significantly. This paper summarizes the development of SR treatment.
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