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首页> 外文期刊>Colloids and Surfaces, A. Physicochemical and Engineering Aspects >Anionic surfactants for defect suppression in 193-nm lithography-Study of the adsorption process by ellipsometry and streaming potential measurements
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Anionic surfactants for defect suppression in 193-nm lithography-Study of the adsorption process by ellipsometry and streaming potential measurements

机译:阴离子表面活性剂,用于193 nm光刻中的缺陷抑制-椭偏和流电势测量研究吸附过程

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摘要

In the present work we developed a strategy to reduce polymer aggregates on a polymer surface formed during the development process in 193-nm microlithography. These polymer aggregates, called "satellite spot defects" or "blob defects", can generate serious problems with decreasing feature size leading to bridging between lines and/or blocking vias. They are caused by insoluble agglomerated resist components that adsorb on developed surfaces. By adding an anionic surfactant to the developer solution the defects could be considerably reduced. It was found that the polymer aggregate reduction in the photolithographic development process coincides with the amount of adsorbed anionic surfactant on the BARC (Bottom Anti-Reflecting Coating) surface and a more negative surface charge. The adsorption process of the anionic surfactant has been studied by null-ellipsometry and streaming potential measurements. The wettability and topography of the surfaces were characterized by contact angle measurements and scanning force microscopy.
机译:在当前的工作中,我们开发了一种减少193 nm光刻过程中形成的聚合物表面上聚合物聚集体的策略。这些被称为“卫星斑点缺陷”或“斑点缺陷”的聚合物聚集体会产生严重的问题,特征尺寸减小,从而导致线之间和/或阻塞通孔之间的桥接。它们是由吸附在显影表面上的不溶性聚集抗蚀剂成分引起的。通过将阴离子表面活性剂添加到显影剂溶液中,可以大大减少缺陷。已经发现,在光刻显影过程中聚合物聚集体的减少与在BARC(底部抗反射涂层)表面上吸附的阴离子表面活性剂的量以及更多的负表面电荷相吻合。阴离子表面活性剂的吸附过程已经通过零椭圆法和流电势测量进行了研究。通过接触角测量和扫描力显微镜来表征表面的润湿性和形貌。

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