Stress Corrosion Cracking of Pure Copper in Acetic Acid Solutions

摘要

The susceptibility of pure copper to stress corrosion cracking (SCC) related to the pH and Cu~(2+) concentrations in acetic acid solutions was studied by examining the nominal stress-strain curves obtained by the slow-strain-rate technique. Clear SCC was observed in solutions with a pH not less than 5 and Cu~(2+) concentration not less than a few thousand ppm, a condition almost identical to that which accelerates the formation of oxide film on the surface of a copper specimen. This strongly indicates that the mechanism of SCC can be interpreted in terms of tarnish film rupture.