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Determination of Pinhole Defects in Diamond-like Carbon Film by Electrochemical Test with CPCD Method

机译:CPCD电化学测试法测定类金刚石碳膜中的针孔缺陷

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Diamond-like carbon (DLC) films were coated on SUS3O4 stainless steel using an ionization deposition method, and the area of defects in the films was determined by the critical passivation current density (CPCD) method. The area of pinhole defects in the DLC films (R_i) was evaluated as a function of applied negative bias voltage and film thickness. The value of R_i was not influenced by the bias voltage for films thinner than 100 nm, but decreased with increasing bias voltage for films thicker than 100 nm. For each bias voltage, the density and size of the defects in the DLC films decreased with increasing thickness. In particular, the Ri-value of the 550 nm film prepared at the bias voltage of -2000 V was approximately 0.01 percent, less by a factor of 100 than that of TiN films of similar thickness prepared by the hollow cathode discharge technique. On the basis of these findings it is concluded that protective ability is remarkably improved by DLC films (thinner than 600 nm) prepared by ionization deposition.
机译:使用电离沉积法将类金刚石碳(DLC)膜涂覆在SUS3O4不锈钢上,并通过临界钝化电流密度(CPCD)方法确定膜中的缺陷面积。根据所施加的负偏置电压和膜厚度来评估DLC膜中的针孔缺陷的面积(R_i)。对于小于100nm的膜,R_i的值不受偏置电压的影响,但是对于大于100nm的膜,R_i的值随着偏置电压的增加而减小。对于每个偏置电压,DLC膜中缺陷的密度和尺寸随厚度的增加而降低。特别地,在-2000V的偏置电压下制备的550nm膜的Ri值约为0.01%,比通过空心阴极放电技术制备的相似厚度的TiN膜的Ri值小100倍。根据这些发现,可以得出结论,通过电离沉积制备的DLC膜(小于600 nm)显着提高了保护能力。

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