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Strain rate dependency of dynamic flow stress of FCC metals at very high strain rate and high temperature

机译:FCC金属在非常高的应变率和高温下的动态流应力的应变率依赖性

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Strain rate sensitivity in FCC metals is known to increase dramatically when the strain rate exceeds about 5×10{sup}3/s. The phenomenon has been interpreted by transition in rate controlling mechanism of dislocation motion from thermal activation to viscous phonon drag. It is generally known that the phonon drag increases with temperature. Usually, however, the experimental flow stress in the viscous flow range shows opposite temperature dependency. In order to clarify the above contradiction andthe mechanism, high strain rate tests are performed for high-purity polycrystalline aluminum and copper in the strain rate range from about 1×10{sup}3~2×10{sup}4/s and at temperatures ranging up to 600K. A simplified model for the dislocation kineticsunder dynamic plastic deformation is used to consider the deformation mechanism in the above strain rate and temperature ranges. The flow stress calculated in consideration of the temperature dependency of the mobile dislocation density shows fairly goodagreement with the flow stress directly measured. The increase in mobile dislocation density with increasing temperature lowers the flow stress and shifts the transition region to the higher strain rate side.
机译:已知当应变速率超过约5×10 {sup} 3 / s时,FCC金属中的应变速率敏感性急剧增加。通过从热激活到粘性声子阻力的位错运动的速率控制机制的转变来解释这种现象。众所周知,声子阻力随温度而增加。但是,通常,在粘性流动范围内的实验流动应力表现出相反的温度依赖性。为了阐明上述矛盾和机理,对高纯度多晶铝和铜进行了高应变速率测试,应变速率范围为大约1×10 {sup} 3〜2×10 {sup} 4 / s,并且在温度范围高达600K。动态塑性变形下位错动力学的简化模型用于考虑上述应变率和温度范围内的变形机理。考虑到移动位错密度的温度依赖性而计算出的流动应力与直接测量的流动应力表现出相当好的一致性。随着温度的升高,移动位错密度的增加降低了流动应力,并将过渡区域移至应变率较高的一侧。

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